Ukusika kweLaser yitekhnoloji esebenzisa i-laser ukwenza umphunga izinto, okukhokelela kumphetho osikiweyo.Ngelixa iqhele ukusetyenziswa kwizicelo zokwenziwa kwemizi-mveliso, ngoku isetyenziswa zizikolo, amashishini amancinci, ulwakhiwo lwezakhiwo, kunye nee-hobbyists.Ukusika kweLaser kusebenza ngokukhokela imveliso yelaser ephezulu yamandla ngokuqhelekileyo ngokusebenzisa i-optics.I-laser optics kunye ne-CNC (ulawulo lwamanani ekhompyutheni) zisetyenziselwa ukuqondisa i-laser beam kwizinto eziphathekayo.I-laser yorhwebo yezinto zokusika isebenzisa inkqubo yokulawula intshukumo ukulandela i-CNC okanye i-G-code yepatheni ukuba inqunywe kwizinto eziphathekayo.Umqa we-laser ogxininisiweyo ujoliswa kwimathiriyeli, ethi ke inyibilike, itshiswe, ibe ngumphunga, okanye ivuthelwe yijethi yerhasi, [1] ishiya umda onomgangatho ophezulu wokugqitywa komphezulu.
Imbali
Ngo-1965, umatshini wokuqala wokusika we-laser wasetyenziselwa ukugrumba imingxuma kwidayimane efa.Lo matshini wenziwa liZiko loPhando lobuNjineli boMbane laseNtshona.[3]Ngo-1967, iBritane yaba nguvulindlela encediswa nge-laser ukusika ijethi yeentsimbi. [4]Ekuqaleni kwee-1970s, obu buchwepheshe bafakwa kwimveliso ukusika i-titanium kwizicelo ze-aerospace.Kwangaxeshanye CO2 lasers zatshintshwa ukuze ukusika non-metals, ezifana nempahla, kuba, ngelo xesha, CO2 lasers zazingenamandla ngokwaneleyo ukoyisa conductivity thermal zesinyithi.[5]
Inkqubo
I-industrial laser cutting yensimbi enemiyalelo yokusika ecwangciswe nge-interface ye-CNC
Umqa weLaser ugxile ngokubanzi usebenzisa ilensi ekumgangatho ophezulu kwindawo yokusebenza.Umgangatho we-beam unempembelelo ngokuthe ngqo kubungakanani bendawo ekugxilwe kuyo.Elona candelo limxinwa lomqadi ogxininisiweyo ngokuqhelekileyo lingaphantsi kwe-0.0125 intshi (0.32 mm) ububanzi.Kuxhomekeke kubukhulu besixhobo, ububanzi be kerf buncinci njenge 0.004 intshi (0.10 mm) buyenzeka.[6]Ukuze ukwazi ukuqala ukusika ukusuka kwenye indawo ngaphandle komda, ukugqobhoza kwenziwa ngaphambi kokusikwa.Ukugqobhoza kudla ngokubandakanya umqadi welaser ovulziweyo wamandla aphezulu othi kancinci wenze umngxuma kwizinto eziphathekayo, uthatha malunga nemizuzwana emi-5 ukuya kwe-15 kwi-0.5-intshi-engqingqwa (13 mm) yentsimbi engatyiwayo, umzekelo.
Iimitha ezihambelanayo zokukhanya okuhambelanayo ukusuka kumthombo we-laser zihlala ziwela kuluhlu oluphakathi kwe-0.06-0.08 intshi (1.5-2.0 mm) ububanzi.Lo mqadi uqhele ukujoliswa kwaye uqiniswe ngelensi okanye isipili ukuya kwindawo encinci kakhulu malunga ne-0.001 intshi (0.025 mm) ukwenza umqadi welaser obukhali kakhulu.Ukuze kuphunyezwe ukugqiba okugudileyo okunokwenzeka ngexesha lokusikwa kwekhonta, icala le-polarization yomqadi kufuneka lijikelezwe njengoko lijikeleza umda womsebenzi ojijelweyo.Ukusika i-sheet metal, ubude bojoliso budla ngokuba yi-1.5-3 intshi (38-76 mm).[7]
Izinto eziluncedo zokusika i-laser phezu kokusikwa koomatshini ziquka ukubamba lula kunye nokunciphisa ukungcoliseka kwe-workpiece (ekubeni akukho mgca wokusika onokuthi ungcoliswe yimpahla okanye ungcolise izinto).Ukuchaneka kunokuba ngcono, ekubeni i-laser beam ayigqoki ngexesha lenkqubo.Kukwakho nethuba elincitshisiweyo lokurhwaphiliza izinto ezisikwayo, njengoko iinkqubo zelaser zinendawo encinci echatshazelwe bubushushu.[8]Ezinye izixhobo nazo zinzima kakhulu okanye azinakwenzeka ukuzisika ngeendlela zemveli.
Ukusika iLaser yesinyithi kunenzuzo ngaphezu kokusikwa kweplasma yokuchaneka ngakumbi[9] kunye nokusebenzisa amandla amancinci xa usikwa isinyithi;nangona kunjalo, iilaser ezininzi zemizi-mveliso azikwazi ukunqumla ubukhulu bentsimbi obunokuthi iplasma inakho.Oomatshini abatsha belaser abasebenza ngamandla aphezulu (i-6000 watts, xa kuthelekiswa noomatshini bokuqala bokusika i-1500 watt) basondela koomatshini beplasma kubuchule babo bokusika izinto ezishinyeneyo, kodwa ixabiso lenkunzi loomatshini liphezulu kakhulu kunelo leplasma. oomatshini bokusika abakwazi ukusika izinto ezingqindilili njengepleyiti yentsimbi.[10]
Iintlobo
4000 watt CO2 laser cutter
Kukho iintlobo ezintathu eziphambili zeelaser ezisetyenziselwa ukusika i-laser.I-CO2 laser ilungele ukusika, ukudika, kunye nokukrola.I-neodymium (Nd) kunye ne-neodymium yttrium-aluminium-garnet (Nd: YAG) iilaser ziyafana ngesitayela kwaye ziyahluka kuphela kwisicelo.Nd isetyenziselwa ukukruqula kwaye apho amandla aphezulu kodwa ukuphindaphinda okuphantsi kuyafuneka.I-laser ye-Nd: YAG isetyenziswa apho kufuneka amandla aphezulu kakhulu kunye nokukruqula nokukrola.Zombini i-CO2 kunye ne-Nd / Nd: ii-laser ze-YAG zingasetyenziselwa ukuwelda.[11]
Ii-laser ze-CO2 ziqhelekile "ukumpontshwa" ngokudlula i-current kumxube werhasi (i-DC-ichulumancile) okanye isebenzisa amandla erediyo yerediyo (i-RF-ichulumancile).Indlela yeRF yintsha kwaye sele idumile.Kuba uyilo lwe-DC lufuna i-electrode ngaphakathi kumngxunya, banokudibana nokukhukuliseka kwe-electrode kunye nokufakwa kwezinto ze-electrode kwi-glassware kunye ne-optics.Ekubeni ii-resonators ze-RF zinee-electrode zangaphandle azikwazi ukufumana ezo ngxaki.I-CO2 lasers isetyenziselwa ukusika kwimizi-mveliso yezinto ezininzi ezibandakanya i-titanium, insimbi engenasici, intsimbi ethambileyo, i-aluminiyamu, iplastiki, iplasitiki, umthi, iinkuni zobunjineli, i-wax, amalaphu kunye nephepha.Iilaser ze-YAG zisetyenziselwa ukusika kunye nokubhala iintsimbi kunye neeseramikhi. [12]
Ukongeza kumthombo wamandla, uhlobo lokuhamba kwegesi lunokuchaphazela ukusebenza ngokunjalo.Iintlobo eziqhelekileyo zeelaser ze-CO2 ziquka ukuhamba kwe-axial ngokukhawuleza, ukuhamba okucothayo kwe-axial, ukuhamba okunqamlezayo, kunye ne-slab.Kwi-axial flow resonator ekhawulezayo, umxube we-carbon dioxide, i-helium kunye ne-nitrogen ijikeleziswa ngesantya esiphezulu nge-injini yomoya okanye i-blower.Iilaser zokuhamba ezinqamlezayo zijikeleza umxube werhasi kwisantya esisezantsi, zifuna isivuthelo esilula.I-Slab okanye i-diffusion resonators epholileyo inendawo yegesi engatshintshiyo engadingi uxinzelelo okanye i-glassware, ekhokelela ekongeni kwii-iturbines ezifakelwayo kunye ne-glassware.
I-laser generator kunye ne-optics yangaphandle (kubandakanywa ne-lens yokugxila) ifuna ukupholisa.Ngokuxhomekeke kubungakanani benkqubo kunye nokulungelelaniswa, ubushushu benkunkuma bunokukhutshelwa ngesipholisi okanye ngokuthe ngqo emoyeni.Amanzi sisipholisi esisetyenziswa ngokuqhelekileyo, esidla ngokujikeleziswa ngesikhenkcisi okanye inkqubo yokudlulisa ubushushu.
I-laser microjet yilaser ekhokelwa yijethi yamanzi apho umqa we-laser wepulsed udityaniswa kwijethi yamanzi enoxinzelelo oluphantsi.Oku kusetyenziselwa ukwenza imisebenzi yokusika i-laser ngelixa usebenzisa ijethi yamanzi ukukhokela i-laser beam, efana ne-fiber optical, ngokubonakalisa kwangaphakathi ngokupheleleyo.Iingenelo zoku kukuba amanzi nawo asusa inkunkuma kwaye apholise izinto.Iingenelo ezongezelelweyo ngaphezu kokusikwa kwelaser "eyomileyo" yemveli ngezantya eziphezulu zokudayela, i-parallel kerf, kunye nokusika kwe-omnidirectional.[13]
I-Fiber lasers luhlobo lwe-laser yombuso oqinileyo okhula ngokukhawuleza ngaphakathi kwishishini lokusika isinyithi.Ngokungafaniyo ne-CO2, itekhnoloji yeFiber isebenzisa i-slide gain medium, ngokuchaseneyo negesi okanye ulwelo.I-"laser yembewu" ivelisa i-laser beam kwaye emva koko yandiswe ngaphakathi kwi-fiber yeglasi.Ngobude obuyi-1064 kuphela yee-nanometers zefiber lasers zivelisa ubungakanani bendawo encinci kakhulu (ukuya kuthi ga kumaxesha angama-100 amancinci xa kuthelekiswa ne-CO2) iyenza ilungele ukusika imathiriyeli yentsimbi ekhanyayo.Le yenye yeenzuzo eziphambili zeFayibha xa kuthelekiswa neCO2.[14]
Izibonelelo zeFiber laser cutter ziquka: -
Amaxesha okusebenza akhawulezayo.
Ukucutha ukusetyenziswa kwamandla kunye namatyala - ngenxa yokusebenza kakuhle.
Ukuthembeka okukhulu kunye nokusebenza - akukho optics ukulungelelanisa okanye ukulungelelanisa kwaye akukho zibane zokutshintsha.
Ukugcinwa okuncinci.
Ukukwazi ukucubungula izinto ezibonakalayo eziphezulu ezifana nobhedu kunye nobhedu
Imveliso ephezulu – iindleko zokusebenza eziphantsi zinika imbuyekezo enkulu kutyalo-mali lwakho.[15]
Iindlela
Kukho iindlela ezininzi ezahlukeneyo zokusika usebenzisa iilaser, ezineentlobo ezahlukeneyo ezisetyenziselwa ukusika izinto ezahlukeneyo.Ezinye zeendlela kukwenza umphunga, ukunyibilika kunye nokuvuthela, ukunyibilika kunye nokutshisa, ukuqhekeka koxinzelelo lwe-thermal, ukuhlaziya, ukusika okubandayo kunye nokutshisa ukusika okuzinzile kwelaser.
Ukusika kwe-vaporization
Kwi-vaporization ukusika umqadi ogxininisiweyo ufudumeza umphezulu wezinto kwi-flashpoint point kwaye uvelise umngxuma wesitshixo.Umngxuma wesitshixo ukhokelela ekunyukeni ngokukhawuleza kokufunxa ngokukhawuleza ukujula umngxuma.Njengoko umngxuma uya usiba nzulu kwaye izinto ziyabila, umphunga owenziweyo ukhukulisa iindonga ezinyibilikayo ezivuthela ngaphandle kwaye wandise ngakumbi umngxuma.Izinto ezinganyibilikiyo ezifana neenkuni, ikhabhoni kunye neeplastiki ze-thermoset zidla ngokusikwa ngale ndlela.
Yinyibilike kwaye uvuthele
Ukunyibilika kunye nokuvuthela okanye ukusika ukudibanisa kusebenzisa igesi ephezulu yoxinzelelo ukuvuthela izinto ezityhidiweyo ezivela kwindawo yokusika, ukunciphisa kakhulu imfuno yamandla.Okokuqala imathiriyeli ifudunyezwa ukuya kutsho kwindawo yokunyibilika emva koko ijethi yerhasi ivuthela imathiriyeli enyibilikisiweyo iphume kwi-kerf inqanda imfuneko yokunyusa ubushushu besixhobo nangakumbi.Izinto ezisikwe ngale nkqubo zidla ngokuba ziintsimbi.
Ukuqhekeka koxinzelelo lwe-thermal
Izinto ezibhityileyo zinovelwano ngakumbi kukuqhekeka kwe-thermal, into esetyenziswa kuxinzelelo lwe-thermal yokuqhekeka.Umqadi ugxile kumphezulu obangela ukufudumeza kwendawo kunye nokwandiswa kwe-thermal.Oku kubangela ukuqhekeka okunokuthi emva koko kukhokelwe ngokuhambisa umqadi.Ukuqhekeka kunokushukunyiswa ngokulandelelana kwe-m/s.Ngokuqhelekileyo isetyenziselwa ukusika iglasi.
Ukudaywa okufihlakeleyo kwee-silicone wafers
Ulwazi oluthe vetshe: I-wafer dicing
Ukwahlulahlula iitshiphusi ze-microelectronic njengoko zilungiselelwe kwisixhobo sokwenziwa kwesixhobo se-semiconductor ukusuka kwi-silicon wafers kunokwenziwa yinto ebizwa ngokuba yinkqubo yokudayela eyi-stealth, esebenza nge-pulsed Nd: YAG laser, ubude bayo (1064 nm) bulungelelaniswe kakuhle kwi-elektroniki. i-band gap ye-silicon (1.11 eV okanye i-1117 nm).
Ukusika okusebenzayo
Ikwabizwa ngokuba "kukutshisa ukuzinzisa ukusika kwegesi ye-laser", "ukusika amadangatye".Ukusika okusebenzayo kufana nokusika itotshi ye-oxygen kodwa nge-laser beam njengomthombo wokutshisa.Ubukhulu becala isetyenziselwa ukusika intsimbi yekhabhoni ngobukhulu obungaphezulu kwe-1 mm.Le nkqubo inokusetyenziselwa ukusika iipleyiti zentsimbi ezishinyeneyo ngamandla amancinane elaser.
Ukunyamezela kunye nokugqitywa komphezulu
Abasiki beLaser banendawo yokuchaneka kweemicrometer ezili-10 kunye nokuphindaphindwa kwee-micrometer ezi-5.[ucaphulo olufunekayo]
Uburhabaxa obuqhelekileyo be-Rz buyanda kunye nobukhulu beshiti, kodwa buyancipha ngamandla e-laser kunye nesantya sokusika.Xa usika intsimbi ephantsi yekhabhoni kunye namandla e-laser ye-800 W, uburhabaxa obuqhelekileyo be-Rz yi-10 μm yeshiti lobukhulu be-1 mm, i-20 μm ye-3 mm, kunye ne-25 μm ye-6 mm.
{\ displaystyle Rz={\ frac {12.528\cdot S^{0.542}}{P^{0.528}\cdot V^{0.322}}}}{\displaystyle Rz={\frac {12.528\cdot S^{0.542} }}{P^{0.528}\cdot V^{0.322}}}}
Apho: {\ isimbo sokubonisa S=}S= ubukhulu beshiti lentsimbi nge-mm;{\displaystyle P=}P= amandla e-laser kwi-kW (abanye abasiki be-laser abatsha banamandla e-laser angama-4 kW);{\displaystyle V=}V= ukusika isantya kwiimitha ngomzuzu.[16]
Le nkqubo iyakwazi ukubamba ukunyamezelana okusondele kakhulu, rhoqo ukuya ngaphakathi kwe-0.001 intshi (0.025 mm).Inxalenye yejometri kunye nesandi soomatshini somatshini sinento yokwenza nesakhono sokunyamezela.Umphezulu oqhelekileyo ogqityiweyo ngenxa yokusikwa komqadi welaser unokuqala ukusuka kwi-125 ukuya kwi-250 micro-intshi (0.003 mm ukuya ku-0.006 mm).[11]
Ulungelelwaniso lomatshini
Dual-pallet optics optics laser
Flying optics intloko laser
Ngokuqhelekileyo kukho ulungelelwaniso oluthathu olwahlukeneyo loomatshini bokusika i-laser yeshishini: izinto ezihambayo, i-hybrid, kunye neenkqubo eziphaphazelayo ze-optics.Ezi zibhekisa kwindlela umqa welaser oshukunyiswa ngayo phezu kwezinto eziza kusikwa okanye zisetyenzwe.Kuzo zonke ezi zinto, ii-axes zentshukumo zichongwa ngokwesiqhelo nguX kunye noY.Ukuba intloko yokusika inokulawulwa, ikhethwe njenge-Z-axis.
I-laser yezinto ezihambayo zinentloko yokusika emileyo kwaye ihambisa izinto phantsi kwayo.Le ndlela ibonelela ngomgama othe gqolo ukusuka kwijenereyitha yelaser ukuya kwindawo yokusebenza kunye nendawo enye yokususa amdaka wokusika.Ifuna ii-optics ezimbalwa, kodwa ifuna ukuhambisa i-workpiece.Lo matshini wesitayile ukholisa ukuba nezona mboniselo zimbalwa zokuhanjiswa kwemiqadi, kodwa ukwathandeka ukuba ngowona ucothayo.
Iilaser eziHybrid zibonelela ngetafile ehamba kwi-axis enye (ngokuqhelekileyo i-X-axis) kwaye ihambisa intloko kwi-axis emfutshane (Y) emfutshane.Oku kukhokelela kubude bendlela yokuhanjiswa kwemiqadi engaguqukiyo kunomatshini ophaphazelayo ophaphazelayo kwaye kunokuvumela inkqubo elula yokuhanjiswa kwebhamu.Oku kunokukhokelela ekunciphiseni ilahleko yamandla kwinkqubo yonikezelo kunye nomthamo omninzi nge-watt nganye kunoomatshini bokubhabha be-optics.
I-Flying optic lasers inetafile emileyo kunye nentloko yokusika (ene-laser beam) ehamba phezu kwendawo yokusebenza kuyo yomibini imilinganiselo ethe tye.Abasiki be-optics ababhabhayo bagcina i-workpiece imile ngexesha lokusetyenzwa kwaye kaninzi ayifuni ukubanjwa kwezinto.Ubunzima obuhambayo buhlala buhlala, ngoko ke i-dynamics ayichatshazelwa bubungakanani obahlukeneyo bomsebenzi.Oomatshini be-Flying optics lolona hlobo lukhawulezayo, oluluncedo xa usika izinto zokusebenza ezibhityileyo.[17]
Oomatshini ababhabhayo be-optic kufuneka basebenzise indlela ethile yokuthathela ingqalelo ubude obutshintshayo bomqadi ukusuka kwibala elikufutshane (kufutshane neresonator) ukusika ukuya kwindawo ekude (ekude neresonator) ukusika.Iindlela eziqhelekileyo zokulawula oku ziquka ukungqubana, i-adaptive optics okanye ukusetyenziswa kwe-axis yobude be-beam engaguqukiyo.
Oomatshini abakwi-axis abahlanu kunye nabathandathu nabo bavumela ukusika izinto zokusebenza ezenziweyo.Ukongeza, kukho iindlela ezahlukeneyo zokuqhelanisa umqa we-laser kwisixhobo sokusebenza esimiliselweyo, ukugcina umgama ochanekileyo wokugxila kunye nokuma kombhobho, njl.
Ukutsala
Iilaser zePulsed ezibonelela ngokugqabhuka kwamandla aphezulu ixesha elifutshane zisebenza kakhulu kwezinye iinkqubo zokusika i-laser, ngakumbi ukugqobhoza, okanye xa imingxuma emincinci kakhulu okanye isantya esisezantsi kakhulu sifuneka, kuba ukuba ibisetyenziswa rhoqo umqadi welaser, ubushushu bunokufikelela kwinqanaba lokunyibilikisa iqhekeza lonke elisikiweyo.
Uninzi lwe-laser zoshishino lunamandla okubetha okanye ukusika i-CW (i-wave eqhubekayo) phantsi kwe-NC (ulawulo lwamanani) ulawulo lwenkqubo.
I-laser ye-pulse ephindwe kabini zisebenzisa uluhlu lwee-pulse pairs ukuphucula izinga lokususa izinto kunye nomgangatho womngxuma.Ngokusisiseko, i-pulse yokuqala isusa izinto ukusuka kumphezulu kwaye okwesibini ithintela i-ejecta ekubambeleleni kwicala lomngxuma okanye ukusika.[18]
Ixesha lokuposa: Jun-16-2022